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Title:
ACTIVE-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, PATTERN FORMATION METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/106535
Kind Code:
A1
Abstract:
Provided are an active-ray-sensitive or radiation-sensitive resin composition, and a pattern formation method and electronic device manufacturing method using said active-ray-sensitive or radiation-sensitive resin composition. The active-ray-sensitive or radiation-sensitive resin composition contains a compound represented by general formula (1), a photoacid generator, and a resin having a polarity that increases by the effect of an acid. The contained amount of the compound represented by general formula (1) is 0.1-500 mass ppm with respect to the total mass of the active-ray-sensitive or radiation-sensitive resin composition. The active-ray-sensitive or radiation-sensitive resin composition suppresses occurrence of development defects over time and has excellent LWR over time. In general formula (1), R1-R3 each independently represent an alkyl group having 1-5 carbon atoms.

Inventors:
YAMAMOTO KEI (JP)
KAWABATA TAKESHI (JP)
FUKUHARA TOSHIAKI (JP)
SHIRAKAWA MICHIHIRO (JP)
Application Number:
PCT/JP2020/041714
Publication Date:
June 03, 2021
Filing Date:
November 09, 2020
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
C07C43/13; C07C69/14; G03F7/004; G03F7/038; G03F7/039; G03F7/20
Domestic Patent References:
WO2018003808A12018-01-04
WO2017175856A12017-10-12
Foreign References:
JP2016135756A2016-07-28
JPH06324483A1994-11-25
JP2011022348A2011-02-03
Attorney, Agent or Firm:
KOH-EI PATENT FIRM, P.C. (JP)
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