Title:
COMPOSITION FOR FORMING RESIST UNDERLAYER FILM INCLUDING TERMINAL-BLOCKING POLYMER
Document Type and Number:
WIPO Patent Application WO/2023/145703
Kind Code:
A1
Abstract:
The present invention provides a composition for forming a resist underlayer film in which a desired resist pattern can be formed, a method for manufacturing a resist pattern using said composition for forming a resist underlayer film, and a method for manufacturing a semiconductor device. The present invention is a composition for forming a resist underlayer film, the composition including an organic solvent and a polymer, the polymer containing, at the terminal, a non-cyclic aliphatic hydrocarbon group that may be interrupted by a group including a heteroatom and that may be substituted by a substitution group.
Inventors:
HIROHARA TOMOTADA (JP)
OGATA HIROTO (JP)
OGATA HIROTO (JP)
Application Number:
PCT/JP2023/002000
Publication Date:
August 03, 2023
Filing Date:
January 24, 2023
Export Citation:
Assignee:
NISSAN CHEMICAL CORP (JP)
International Classes:
G03F7/11; G03F7/20
Domestic Patent References:
| WO2015019961A1 | 2015-02-12 | |||
| WO2013141015A1 | 2013-09-26 | |||
| WO2012124597A1 | 2012-09-20 | |||
| WO2016208472A1 | 2016-12-29 | |||
| WO2005098542A1 | 2005-10-20 |
Foreign References:
| JP2009093162A | 2009-04-30 |
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
Download PDF: