Title:
COMPOSITION FOR FORMING UPPER LAYER FILM, METHOD FOR FORMING PATTERN USING SAME, AND PROCESS FOR PRODUCING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/136596
Kind Code:
A1
Abstract:
A polymer-containing composition for forming an upper layer film for photoresists is provided in which the polymer gives, in an examination by gel permeation chromatography, a molecular weight distribution in which the peak area for high-molecular-weight components each having a weight-average molecular weight of 40,000 or higher accounts for 0.1% or less of the overall peak area. From the composition for forming an upper layer film for photoresists, it is possible to form a trench pattern or hole pattern having an exceedingly small width or hole diameter (e.g., 60 nm or less) so as to attain high focus latitude (depth of focus (DOF)) performance. Also provided are a method for forming a pattern using the composition and a process for producing an electronic device.
Inventors:
GOTO AKIYOSHI (JP)
INOUE NAOKI (JP)
TANGO NAOHIRO (JP)
YAMAMOTO KEI (JP)
SHIRAKAWA MICHIHIRO (JP)
INOUE NAOKI (JP)
TANGO NAOHIRO (JP)
YAMAMOTO KEI (JP)
SHIRAKAWA MICHIHIRO (JP)
Application Number:
PCT/JP2016/054751
Publication Date:
September 01, 2016
Filing Date:
February 18, 2016
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/11; C08F20/38; G03F7/32; H01L21/027
Foreign References:
| JP2015011169A | 2015-01-19 | |||
| JPH01289822A | 1989-11-21 | |||
| JP2013061648A | 2013-04-04 | |||
| JP2008309878A | 2008-12-25 | |||
| JP2010006863A | 2010-01-14 | |||
| JP2008046542A | 2008-02-28 |
Attorney, Agent or Firm:
TAKAMATSU Takeshi et al. (JP)
Takamatsu 猛 (JP)
Takamatsu 猛 (JP)
Download PDF: