Title:
COMPOSITION FOR FORMULATION, FORMULATION AND METHOD FOR MANUFACTURING COMPOSITION FOR FORMULATION
Document Type and Number:
WIPO Patent Application WO/2023/145868
Kind Code:
A1
Abstract:
Provided are a composition for a formulation which can be easily manufactured and from which a formulation having high hardness can be easily obtained, a formulation comprising the composition, and a method for manufacturing the composition for a formulation. The composition for a formulation of the present invention comprises particles containing an active ingredient and a binder, wherein: the content of the active ingredient is 80 mass% or more relative to the total mass of the active ingredient and the binder; and the coverage of the binder on the surface of the particles is 20% or more. The method for manufacturing the composition for a formulation of the present invention comprises step 1 for kneading and granulating a mixture containing an active ingredient and a binder in a barrel by the twin-screw extrusion method, wherein: the temperature in the barrel is 130°C or lower; the mass average molecular weight of the binder is 1000000 g/mol or lower; and the mixture contains 80 mass% or more of the active ingredient relative to the total mass of the active ingredient and the binder.
Inventors:
FUJISAKI MOTOHARU (JP)
KIMURA AKIRA (JP)
KIMURA AKIRA (JP)
Application Number:
PCT/JP2023/002610
Publication Date:
August 03, 2023
Filing Date:
January 27, 2023
Export Citation:
Assignee:
SUMITOMO SEIKA CHEMICALS (JP)
International Classes:
A61K9/16; A61K9/20; A61K31/167; A61K47/10; A61K47/32; A61K47/38; A61P29/00
Domestic Patent References:
| WO2021089848A1 | 2021-05-14 |
Foreign References:
| JP2017122056A | 2017-07-13 | |||
| JP2016124800A | 2016-07-11 | |||
| JPS6191118A | 1986-05-09 | |||
| JPH11335268A | 1999-12-07 | |||
| US20100159018A1 | 2010-06-24 | |||
| JP2005527508A | 2005-09-15 | |||
| JP2013501810A | 2013-01-17 | |||
| JP2014524925A | 2014-09-25 |
Attorney, Agent or Firm:
SAEGUSA & PARTNERS (JP)
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