Title:
COMPOSITION FOR HOT-MELT ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2023/223689
Kind Code:
A1
Abstract:
Provided is a composition which is for a hot-melt adhesive, contains a poly(3-hydroxyalkanoate)-based resin, has a reduced melt viscosity, and has good mechanical properties. The composition for a hot-melt adhesive contains a poly(3-hydroxyalkanoate)-based resin (A), and a polycaprolactone (B). The poly(3-hydroxyalkanoate)-based resin (A) may be a poly(3-hydroxybutyrate-co-3-hydroxyhexanoate) copolymer. A laminate can be produced by melting, through heating, the composition for a hot-melt adhesive, applying the molten composition to a first substrate, then bonding a coated surface to a second substrate, and cooling the composition to bond the first substrate and the second substrate.
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Inventors:
TANAKA HIDENORI
Application Number:
PCT/JP2023/013521
Publication Date:
November 23, 2023
Filing Date:
March 31, 2023
Export Citation:
Assignee:
KANEKA CORP (JP)
International Classes:
B32B27/36; B32B37/12; C08L101/16; C09J5/06; C09J11/06; C09J167/04
Foreign References:
| JPH11193371A | 1999-07-21 | |||
| JPH05271638A | 1993-10-19 | |||
| JP2010506979A | 2010-03-04 |
Attorney, Agent or Firm:
ARCO PATENT & TRADEMARK ATTORNEYS (JP)
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