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Title:
COMPOSITION AND MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2019/159864
Kind Code:
A1
Abstract:
Provided is a composition useful for the production of a molded body capable of reducing biofilm adhesion. This composition contains: at least one resin (A) selected from the group consisting of a thermoplastic resin and a thermosetting resin; and a quorum sensing inhibitor (B), wherein a common logarithm logS of solubility of the quorum sensing inhibitor (B) in water at 25°C is less than 0.1, and the distance Ra1 between the Hansen solubility parameter of the at least one resin (A) selected from the group consisting of a thermoplastic resin and a thermosetting resin and the Hansen solubility parameter of the quorum sensing inhibitor (B) is greater than 3.2 MPa1/2.

More Like This:
JPS5136411JUKIKAGOBUTSUNO SEIZOHOHO
Inventors:
SAKURADA KENTA (JP)
NITTA EIJI (JP)
ICHIMIYA TAKAYA (JP)
KONISHI SHOTA (JP)
Application Number:
PCT/JP2019/004785
Publication Date:
August 22, 2019
Filing Date:
February 12, 2019
Export Citation:
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Assignee:
SUMITOMO CHEMICAL CO (JP)
International Classes:
C08L101/00; C08K11/00
Domestic Patent References:
WO2014080873A12014-05-30
Foreign References:
JP2016214126A2016-12-22
JP2016185935A2016-10-27
US20100137249A12010-06-03
US20110281921A12011-11-17
US20180230318A12018-08-16
JP2002020632A2002-01-23
JP2017115044A2017-06-29
JP2002069178A2002-03-08
Other References:
SENSORS, vol. 13, 2013, pages 5117 - 5129
C.M. HANSEN: "Hansen solubility parameter: A user's Handbook", 2007, TAYLOR AND FRANCIS GROUP, LLC
RSC ADV., vol. 5, 2015, pages 53054 - 53062
See also references of EP 3753986A4
Attorney, Agent or Firm:
NAKAYAMA, Tohru et al. (JP)
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