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Patent Searching and Data


Title:
COMPOSITION AND MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2019/159864
Kind Code:
A1
Abstract:
Provided is a composition useful for the production of a molded body capable of reducing biofilm adhesion. This composition contains: at least one resin (A) selected from the group consisting of a thermoplastic resin and a thermosetting resin; and a quorum sensing inhibitor (B), wherein a common logarithm logS of solubility of the quorum sensing inhibitor (B) in water at 25°C is less than 0.1, and the distance Ra1 between the Hansen solubility parameter of the at least one resin (A) selected from the group consisting of a thermoplastic resin and a thermosetting resin and the Hansen solubility parameter of the quorum sensing inhibitor (B) is greater than 3.2 MPa1/2.

Inventors:
SAKURADA, Kenta (LIMITED 5-1, Anesaki-Kaigan, Ichihara-sh, Chiba 95, 〒2990195, JP)
NITTA, Eiji (LIMITED 1-98, Kasugadenaka 3-chome, Konohana-ku, Osaka-sh, Osaka 58, 〒5548558, JP)
ICHIMIYA, Takaya (LIMITED 5-1, Anesaki-Kaigan, Ichihara-sh, Chiba 95, 〒2990195, JP)
KONISHI, Shota (LIMITED 5-1, Sobiraki-cho, Niihama-sh, Ehime 21, 〒7928521, JP)
Application Number:
JP2019/004785
Publication Date:
August 22, 2019
Filing Date:
February 12, 2019
Export Citation:
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Assignee:
SUMITOMO CHEMICAL COMPANY, LIMITED (27-1, Shinkawa 2-chome Chuo-k, Tokyo 60, 〒1048260, JP)
International Classes:
C08L101/00; C08K11/00
Foreign References:
JP2016214126A2016-12-22
JP2016185935A2016-10-27
US20100137249A12010-06-03
US20110281921A12011-11-17
US20180230318A12018-08-16
Attorney, Agent or Firm:
NAKAYAMA, Tohru et al. (LIMITED 5-33, Kitahama 4-chome, Chuo-ku, Osaka-sh, Osaka 50, 〒5418550, JP)
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