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Title:
COMPOSITION FOR POLISHING EDGE OF SUBSTRATE, AND METHOD FOR POLISHING EDGE OF SUBSTRATE USING SAME
Document Type and Number:
WIPO Patent Application WO/2012/141145
Kind Code:
A1
Abstract:
Disclosed is a composition for polishing an edge, which comprises 0.0001 mass% or more of a synthetic water-soluble polymer having a heterocyclic ring in a side chain or at an end thereof, a basic compound and water. The synthetic water-soluble polymer in the composition for polishing an edge preferably has a weight average molecular weight of 1,000 or more in terms of polyoxyethylene. The heterocyclic ring in the synthetic water-soluble polymer is preferably a lactam ring or a tetrahydrofuran ring. Preferred examples of the synthetic water-soluble polymer include polyvinylpyrrolidone, polyvinylcaprolactam, polyoxyethylene sorbitan monolaurate, and polyoxyethylene sorbitan trioleate.

Inventors:
SHINODA TOSHIO (JP)
OGINO KAZUNOBU (JP)
TAKAHASHI SHUHEI (JP)
IDE SHOGAKU (JP)
Application Number:
PCT/JP2012/059719
Publication Date:
October 18, 2012
Filing Date:
April 09, 2012
Export Citation:
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Assignee:
FUJIMI INC (JP)
SHINODA TOSHIO (JP)
OGINO KAZUNOBU (JP)
TAKAHASHI SHUHEI (JP)
IDE SHOGAKU (JP)
International Classes:
H01L21/304; B24B37/00; C09K3/14
Domestic Patent References:
WO2005029563A12005-03-31
Foreign References:
JP2010182811A2010-08-19
JP2010283184A2010-12-16
JP2004128069A2004-04-22
Attorney, Agent or Firm:
ONDA, Hironori et al. (JP)
Hironori Onda (JP)
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Claims: