COMPOSITION FOR THERMALLY CONDUCTIVE MATERIAL AND THERMALLY CONDUCTIVE MATERIAL

Title:

COMPOSITION FOR THERMALLY CONDUCTIVE MATERIAL AND THERMALLY CONDUCTIVE MATERIAL

Document Type and Number:

WIPO Patent Application WO/2018/221719

Kind Code:

A1

Abstract:

Provided is a thermally conductive material which is grease-like, uses a non-silicone resin, and has excellent heat resistance. This composition for thermally conductive material includes: an acrylic polymer (A) having at least two crosslinkable functional groups containing a carbon-carbon unsaturated bond; an acrylic polymer (B) having at least one of such crosslinkable functional groups; a drip preventing agent; and a thermally conductive filler. The amount dispensed is 1.50-4.25 g/min as measured under prescribed discharge-pressure conditions using a dispensing controller.

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Inventors:

YOSHINO HIROTO (JP)
YUOKA TERUAKI (JP)

Application Number:

PCT/JP2018/021154

Publication Date:

December 06, 2018

Filing Date:

June 01, 2018

Export Citation:

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Assignee:

KITAGAWA IND CO LTD (JP)

International Classes:

C08F299/00; C08L27/18; C08L33/04

Domestic Patent References:

WO2012043426A1

2012-04-05

Foreign References:

JP2006278476A	2006-10-12
JP2009067950A	2009-04-02
JP2009179743A	2009-08-13
JP2012229338A	2012-11-22
JP2014526585A	2014-10-06
JP2015071719A	2015-04-16
JP2015089911A	2015-05-11
JP2015140395A	2015-08-03
JP2010242022A	2010-10-28
US7208192B2	2007-04-24

Other References: