Title:
COMPOUND FOR FLEX SOLE
Document Type and Number:
WIPO Patent Application WO2003105618
Kind Code:
A3
Abstract:
The present invention discloses a compound and a method for a cushion pad that is bonded to an outsole without the need for glue or other adhesives. This cushion pad can be softer and more flexible then the outsole but can be similar enough in composition to be recyclable without having to separate it from the outsole. The compound can consist of a styrene-butadiene-styrene triblock copolymer, ethyl-vinyl-acetate, peroxide, a filler agent, and a blowing agent. The combination of these materials will form a high rubber content foam sheet that is very soft and shock adsorbing. This process can use the above compound to manufacture a rubber outsole with an integrated cushioning pad that can be manufactured in one step.
Inventors:
HERNANDEZ HOMER (US)
Application Number:
PCT/US2003/019498
Publication Date:
March 25, 2004
Filing Date:
June 18, 2003
Export Citation:
Assignee:
BBC INTERNAT LTD (US)
HERNANDEZ HOMER (US)
HERNANDEZ HOMER (US)
International Classes:
A43B13/04; B29D35/14; (IPC1-7): A43B13/02; A43B1/00; A43B13/18
Foreign References:
| US3485787A | 1969-12-23 | |||
| US5756195A | 1998-05-26 | |||
| US5766704A | 1998-06-16 | |||
| US5985383A | 1999-11-16 | |||
| US5994450A | 1999-11-30 | |||
| US6367172B2 | 2002-04-09 |
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