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Patent Searching and Data


Title:
COMPRESSION MOLD, RESIN MOLDING DEVICE, RESIN MOLDING SYSTEM, AND METHOD FOR MANUFACTURING RESIN MOLDED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2022/102232
Kind Code:
A1
Abstract:
A compression mold (10) is provided with a first mold (110) and a second mold (120). The first mold (110) is provided with a lateral member (111) and a bottom member (112). The lateral member (111) is provided with a stepped portion (113) on the bottom member (112) side of the lateral member (111). The stepped portion (113) is provided with a first face (111a) of the lateral member (111), a second face (111b) extending from the first face (111a) to the bottom member (112), and a third face (111c) extending downward from the second face (111b). The bottom member (112) is provided with an upper face (112a) on which a resin material (202) can be placed, and a sliding face (112b) extending downward from the upper face (112a) and slidable with respect to the third face (111c) of the lateral member (111). The third face (111c) of the lateral member (111) is not exposed upon supply of the resin material (202).

Inventors:
YOSHIDA YUSUKE (JP)
ONISHI YOHEI (JP)
Application Number:
PCT/JP2021/033285
Publication Date:
May 19, 2022
Filing Date:
September 10, 2021
Export Citation:
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Assignee:
TOWA CORP (JP)
International Classes:
B29C33/12; B29C43/18; B29C43/34; B29C43/36
Foreign References:
JP2009083438A2009-04-23
JP2012061728A2012-03-29
JP2005305951A2005-11-04
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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