Title:
CONDUCTIVE ADHESIVE COMPOSITION, AND METHOD FOR PRODUCING CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2021/161963
Kind Code:
A1
Abstract:
Disclosed is a conductive adhesive composition containing (A) conductive particles, (B) a thermosetting resin, and (C) a flux activator. The conductive particles include a metal having a melting point of 200°C or lower. In a volume-based cumulative particle size distribution of the conductive particles, the cumulative 50% particle diameter D50 is 3-10 μm and the cumulative 10% particle diameter D10 is 2.4 μm or larger. The flux activator contains a compound having a hydroxyl group and a carboxyl group. The conductive adhesive composition is used to electrically connect a circuit board 2 and an electronic component 3 mounted on the circuit board.
Inventors:
SUKATA SHINICHIROU (JP)
Application Number:
PCT/JP2021/004607
Publication Date:
August 19, 2021
Filing Date:
February 08, 2021
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C09J5/06; C09J9/02; C09J11/04; C09J11/06; C09J163/00; C09J201/00; H01B1/22; H01L21/60
Foreign References:
| JP2017112312A | 2017-06-22 | |||
| JP2015026519A | 2015-02-05 | |||
| JP2018168336A | 2018-11-01 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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