CONDUCTIVE ADHESIVE COMPOSITION, AND METHOD FOR PRODUCING IMAGING MODULE

WIPO Patent Application WO/2021/161964

A1

Disclosed is a conductive adhesive composition used for producing an imaging module 101 comprising a wiring board 10 and a semiconductor component 20 that contains a solid-state imaging element 21. The solid-state imaging element 21 is a wafer-level chip-size package. The conductive adhesive composition contains (A) conductive particles that include a metal, (B) a thermosetting resin, and (C) a flux activator. The flux activator contains a compound having a hydroxyl group and a carboxyl group. The amount of the flux activator is 1.0-3.9 mass% relative to the mass of the conductive particles. A connection portion 8 is formed by means of the conductive adhesive composition.

JPS58113281	PRESSURE-SENSITIVE ADHESIVE TAPE
JP2005325312	ADHESIVE COMPOSITION, FILM-TYPE ADHESIVE AGENT AND CIRCUIT CONNECTING MATERIAL USING THE SAME AND CONNECTION STRUCTURE OF CIRCUIT MATERIAL AND ITS PREPARATION METHOD
JP2001131250	ACRYLIC COPOLYMER, ACRYLIC PRESSURE SENSITIVE ADHESIVE COMPOSITION, ACRYLIC PRESSURE SENSITIVE ADHESIVE TAPE OR SHEET, AND ACRYLIC ADHESIVE COMPOSITION

SUKATA SHINICHIROU (JP)

PCT/JP2021/004618

August 19, 2021

February 08, 2021

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SHOWA DENKO MATERIALS CO LTD (JP)

C09J5/06; C09J9/02; C09J11/04; C09J11/06; C09J163/00; C09J201/00; H01B1/22; H01L31/02

JP2017112312A	2017-06-22
JP2015026519A	2015-02-05
JP2018168336A	2018-11-01
JP2005136144A	2005-05-26

HASEGAWA Yoshiki et al. (JP)

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