Title:
CONDUCTIVE COATING, AND METHOD FOR RESIN MOLDED ARTICLE HAVING SHIELDING LAYER
Document Type and Number:
WIPO Patent Application WO/2024/048627
Kind Code:
A1
Abstract:
This conductive coating contains, with respect to 100 parts by mass of a binder component (A) containing an epoxy resin: 1200-3200 parts by mass of metal particles (B); 70-200 parts by mass of a block isocyanate curing agent (C); 5-50 parts by mass of a curing agent (D) that is at least one selected from the group consisting of an amine-based curing agent and an imidazole-based curing agent; and 100-1,500 parts by mass of a solvent (E).
Inventors:
NAKAZONO HAJIME (JP)
Application Number:
PCT/JP2023/031409
Publication Date:
March 07, 2024
Filing Date:
August 30, 2023
Export Citation:
Assignee:
TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)
International Classes:
C09D163/00; C08G59/40; C09D5/24; C09D7/61; C09D7/62; C09D7/63; C09D175/04
Domestic Patent References:
| WO2021014964A1 | 2021-01-28 | |||
| WO2014119463A1 | 2014-08-07 |
Foreign References:
| JP2013149596A | 2013-08-01 | |||
| JP2011252140A | 2011-12-15 | |||
| JPS59124965A | 1984-07-19 |
Attorney, Agent or Firm:
TSUTADA & CO. (JP)
Download PDF: