Title:
CONDUCTIVE PASTE AND MULTILAYER SUBSTRATE USING SAME
Document Type and Number:
WIPO Patent Application WO/2024/048628
Kind Code:
A1
Abstract:
This conductive paste contains, with respect to (A) 100 parts by mass of a binder component containing 5-60 parts by mass of a solid epoxy resin and 40-95 parts by mass of a liquid epoxy resin in a range not exceeding a total amount of 100 parts by mass: (B) 770-4300 parts by mass of spherical high-melting-point metal particles having a melting point of at least 800°C; (C) 1510-5400 parts by mass of spherical low-melting-point metal particles having a melting point of at most 240°C; (D) 10-150 parts by mass of a curing agent; and (E) 30-200 parts by mass of a flux.
Inventors:
NAKAZONO HAJIME (JP)
NISHIMURA NAOTO (JP)
FUJIKAWA RYOTA (JP)
SAKAUE NAOKI (JP)
NISHIMURA NAOTO (JP)
FUJIKAWA RYOTA (JP)
SAKAUE NAOKI (JP)
Application Number:
PCT/JP2023/031411
Publication Date:
March 07, 2024
Filing Date:
August 30, 2023
Export Citation:
Assignee:
TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)
International Classes:
H01B1/22; H05K1/09
Domestic Patent References:
| WO2022034696A1 | 2022-02-17 | |||
| WO2017138256A1 | 2017-08-17 | |||
| WO2015174299A1 | 2015-11-19 |
Foreign References:
| JP2008108629A | 2008-05-08 | |||
| JP2002201448A | 2002-07-19 |
Attorney, Agent or Firm:
TSUTADA & CO. (JP)
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