CONDUCTIVE MATERIAL COMPOSITIONS, APPARATUS, SYSTEMS, AND METHODS

Title:

CONDUCTIVE MATERIAL COMPOSITIONS, APPARATUS, SYSTEMS, AND METHODS

Document Type and Number:

WIPO Patent Application WO2005071750

Kind Code:

A3

Abstract:

Various apparatus and systems, as well as methods and articles, may include the use of several compositions, such as solder formulations, including about 78 %-83 % by weight of lead, about 9 %-11 % by weight of antimony, about 1 %-3 % by weight of silver, and a balance of tin. Some embodiments include a process of removing a previously-existing lead finish, and applying a new finish to the lead to improve solder operation compatibility, as well as solder joint reliability in high temperature environments.

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Inventors:

DEEPAK JAMES CHRISTOPHER (US)
HRAMETZ ANDREW ALBERT (US)

Application Number:

PCT/US2005/000599

Publication Date:

January 12, 2006

Filing Date:

January 10, 2005

Export Citation:

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Assignee:

HALLIBURTON ENERGY SERV INC (US)
DEEPAK JAMES CHRISTOPHER (US)
HRAMETZ ANDREW ALBERT (US)

International Classes:

H01L21/02; H01L21/48; H01L23/495; H01L23/498; H05K3/34; B23K35/26; (IPC1-7): H01L23/495; H01L21/02

Domestic Patent References:

WO1987004008A1	1987-07-02
WO1982003294A1	1982-09-30

Foreign References:

US4524241A	1985-06-18
US20030037959A1	2003-02-27
US5650661A	1997-07-22
US4170472A	1979-10-09
EP0507718A1	1992-10-07

Other References:

PATENT ABSTRACTS OF JAPAN vol. 1999, no. 12 29 October 1999 (1999-10-29)
PATENT ABSTRACTS OF JAPAN vol. 008, no. 195 (M - 323) 7 September 1984 (1984-09-07)
PATENT ABSTRACTS OF JAPAN vol. 017, no. 164 (M - 1390) 30 March 1993 (1993-03-30)
BURLING S: "PRE-PLATED PALLADIUM LEAD FRAMES VS SPOT SELECTIVE SILVER AND TIN-LEAD", TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING, INSTITUTE OF METAL FINISHING, LONDON, GB, vol. 76, no. PART 2, March 1998 (1998-03-01), pages B23 - B25, XP000751326, ISSN: 0020-2967
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 04 31 March 1998 (1998-03-31)

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