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Title:
CONDUCTIVE METAL PASTE
Document Type and Number:
WIPO Patent Application WO/2020/202280
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a conductive metal paste having improved conductivity without increasing the amount of a conductive filler to be added. The conductive metal paste contains a metal filler and less than 1 mass% of an ionic liquid, and does not contain carbon nanotubes.

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Inventors:
MASUDA GEN (JP)
Application Number:
PCT/JP2019/014091
Publication Date:
October 08, 2020
Filing Date:
March 29, 2019
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Assignee:
NISSHINBO HOLDINGS INC (JP)
International Classes:
H01B1/22
Domestic Patent References:
WO2017183342A12017-10-26
WO2002076924A12002-10-03
WO2016103906A12016-06-30
WO2013005712A12013-01-10
Foreign References:
JP2018035286A2018-03-08
JP2017073365A2017-04-13
JP2014114420A2014-06-26
JP2017036234A2017-02-16
Other References:
See also references of EP 3951801A4
Attorney, Agent or Firm:
PATENT PROFESSIONAL CORPORATION EI-MEI PATENT OFFICE (JP)
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