Title:
CONDUCTIVE PASTE FOR LASER ETCHING, CONDUCTIVE THIN FILM AND CONDUCTIVE LAMINATE
Document Type and Number:
WIPO Patent Application WO/2015/111614
Kind Code:
A1
Abstract:
[Problem] To provide a conductive paste for laser etching, which is suitable for laser etching that is capable of producing high-density electrode circuit wiring lines having an L/S of 50/50 μm or less at a low cost with a low environmental load, said high-density electrode circuit wiring lines having been considered difficult to be produced by a conventional screen printing method, and that is also capable of reducing thermal deterioration of a base.
[Solution] A conductive paste for laser etching, which contains (A) a binder resin that is composed of a thermoplastic resin, (B) a metal powder and (C) an organic solvent, and which is characterized in that the binder resin (A) is a thermoplastic resin that has a number average molecular weight of 5,000-60,000 and a glass transition temperature of less than 60°C; a conductive thin film which is formed using the conductive paste; a conductive laminate; an electrical circuit; and a touch panel.
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Inventors:
EGUCHI KENICHI (JP)
SAKAMOTO YASUHIRO (JP)
SAKAMOTO YASUHIRO (JP)
Application Number:
PCT/JP2015/051520
Publication Date:
July 30, 2015
Filing Date:
January 21, 2015
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
H01B1/22; B32B27/18; G06F3/041; H01B5/14
Domestic Patent References:
| WO2014013899A1 | 2014-01-23 | |||
| WO2011046076A1 | 2011-04-21 |
Foreign References:
| JP2014107533A | 2014-06-09 | |||
| JP2014002992A | 2014-01-09 | |||
| JP2008013809A | 2008-01-24 | |||
| JP2010044968A | 2010-02-25 |
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