Title:
CONDUCTIVE PASTE, RFID INLAY, METHOD FOR PRODUCING RFID INLAY, USE OF CONDUCTIVE PASTE FOR PURPOSE OF BONDING CHIP, AND USE OF CONDUCTIVE PASTE FOR PURPOSE OF OBTAINING RFID INLAY
Document Type and Number:
WIPO Patent Application WO/2024/010060
Kind Code:
A1
Abstract:
The present invention provides a conductive paste which is capable of increasing bondability and is also capable of increasing conduction reliability. A conductive paste according to the present invention contains a curable compound, a plurality of conductive particles and a thermal polymerization initiator; the curable compound contains a urethane (meth)acrylate which has a molecular weight of 1,000 or more, while having an aromatic skeleton, and a polymerizable monomer which has a molecular weight of less than 1,000, while having an aromatic skeleton or an alicyclic skeleton; and the viscosity of the conductive paste at 25°C is 5 Pa∙s to 50 Pa∙s.
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Inventors:
DOBASHI YUTO (US)
KOBAYASHI HIROSHI (JP)
KOBAYASHI HIROSHI (JP)
Application Number:
PCT/JP2023/025104
Publication Date:
January 11, 2024
Filing Date:
July 06, 2023
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
H01B1/22; C09J4/00; C09J9/02; C09J175/14; H01B1/00
Foreign References:
| JP2022500874A | 2022-01-04 | |||
| JP2016186935A | 2016-10-27 | |||
| JP2005236040A | 2005-09-02 | |||
| JP2021109889A | 2021-08-02 | |||
| JP2021191820A | 2021-12-16 |
Attorney, Agent or Firm:
OSAKA FRONT (JP)
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