Title:
CURABLE RESIN COMPOSITION AND SEALING AGENT FOR ORGANIC EL DISPLAY ELEMENTS
Document Type and Number:
WIPO Patent Application WO/2024/010059
Kind Code:
A1
Abstract:
A purpose of the present invention is to provide a curable resin composition which enables the achievement of a cured product that exhibits excellent heat resistance and low outgas properties, while having a low dielectric constant. Another purpose of the present invention is to provide a sealing agent for organic EL display elements, the sealing agent containing this curable resin composition. The present invention provides a curable resin composition which contains a curable resin and a polymerization initiator, wherein: the curable resin contains a multifunctional cationically polymerizable compound which has three or more cationically polymerizable groups in each molecule; the polymerization initiator contains a cationic polymerization initiator; and the dielectric constant of a cured product thereof as measured at 25°C and 100 kHz is 3.0 or less.
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Inventors:
TAKEMURA KENGO (JP)
ABE MARIKO (JP)
TAKENAKA MIKA (JP)
YAMAMOTO TAKUYA (JP)
ABE MARIKO (JP)
TAKENAKA MIKA (JP)
YAMAMOTO TAKUYA (JP)
Application Number:
PCT/JP2023/025092
Publication Date:
January 11, 2024
Filing Date:
July 06, 2023
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C08G59/32; C08G65/18; H01L23/29; H01L23/31
Domestic Patent References:
| WO2007074813A1 | 2007-07-05 | |||
| WO2021131790A1 | 2021-07-01 | |||
| WO2017082356A1 | 2017-05-18 |
Foreign References:
| JP2004238589A | 2004-08-26 | |||
| JP2018119032A | 2018-08-02 | |||
| JP2009280767A | 2009-12-03 | |||
| JP2012046752A | 2012-03-08 | |||
| JP2013234333A | 2013-11-21 | |||
| JP2013093602A | 2013-05-16 |
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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