Title:
CONDUCTIVE PATTERN, CONDUCTIVE CIRCUIT, AND METHOD FOR PRODUCING CONDUCTIVE PATTERN
Document Type and Number:
WIPO Patent Application WO/2013/172229
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a conductive pattern which has low resistance and excellent conductivity, while having excellent adhesion enough to prevent separation of a conductive substance from the conductive pattern.
The present invention relates to a conductive pattern, which is obtained by applying a primer onto a supporting body, and then applying a fluid (a) containing a polyhydric alcohol (a1) that contains a predetermined diol (a1-1) and a conductive substance (a2) onto the surface of a coating film (x) that is formed using the primer and heating the applied fluid, and in which the supporting body, a primer layer (X) that is formed by heating the coating film (x) and a layer (Y) containing the conductive substance (a2) are laminated. The coating film (x) absorbs 20-500% by mass of ethanol relative to the mass of the coating film (x).
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Inventors:
SAITOU YUKIE (JP)
SHIRAKAMI JUN (JP)
MURAKAWA AKIRA (JP)
FUJIKAWA WATARU (JP)
SHIRAKAMI JUN (JP)
MURAKAWA AKIRA (JP)
FUJIKAWA WATARU (JP)
Application Number:
PCT/JP2013/062910
Publication Date:
November 21, 2013
Filing Date:
May 08, 2013
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
H05K3/38; H05K1/09; H05K3/12; H05K9/00
Foreign References:
JP2010225659A | 2010-10-07 | |||
JP2010024526A | 2010-02-04 |
Attorney, Agent or Firm:
KONO MICHIHIRO (JP)
Michihiro Kono (JP)
Michihiro Kono (JP)
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