Title:
CONDUCTIVE RESIN, METHOD FOR PRODUCING SAME AND SENSOR
Document Type and Number:
WIPO Patent Application WO/2022/113729
Kind Code:
A1
Abstract:
The present invention provides: a conductive resin which is able to be suppressed in an increase in the production cost; a method for producing this conductive resin; and a sensor which is provided with this conductive resin. This conductive resin is a porous conductive resin which is characterized by being produced by a process wherein: a deep eutectic liquid is formed by mixing a hydrogen bond donor compound and a hydrogen bond acceptor compound with each other; a gel is formed by adding a conductive material to the deep eutectic liquid; a resin that is insoluble in the deep eutectic liquid is added to the gel, thereby forming an ink wherein the gel is dispersed in the resin; the thus-formed ink is formed into a shaped article that has a desired shape; and the resin in the shaped article is cured, and the deep eutectic liquid in the shaped article, wherein the resin has been cured, is evaporated.
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Inventors:
YOSHIDA AYAKO (JP)
WANG YI-FEI (JP)
TOKITO SHIZUO (JP)
WANG YI-FEI (JP)
TOKITO SHIZUO (JP)
Application Number:
PCT/JP2021/041218
Publication Date:
June 02, 2022
Filing Date:
November 09, 2021
Export Citation:
Assignee:
UNIV YAMAGATA NAT UNIV CORP (JP)
International Classes:
C08J9/28; B29C67/20; H01B1/20; H01B13/00
Domestic Patent References:
| WO2015128550A1 | 2015-09-03 |
Foreign References:
| JP2018529013A | 2018-10-04 | |||
| JP2012057137A | 2012-03-22 | |||
| CN110698717A | 2020-01-17 | |||
| CN111073024A | 2020-04-28 |
Attorney, Agent or Firm:
EBISU INTERNATIONAL PATENT OFFICE (JP)
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