Such a tile is known for instance from DE 4406693. The invention described in this document relates to tiles for work areas in which electrical or optical instruments are present. The composition used to manufacture such tiles comprises a polyolefin from the group HDPE, polypropylene and/or polybutylene, a non-conductive filler material and a conductive filler material such as stainless steel fibres.

These tiles are manufactured by: - extruding all elements of the composition to form granules, without the metal fibres; - mixing the granules with the metal fibres; - extruding this mixture in a foil extruding machine to obtain a flexible plastic plate ; - cutting this foil to form tiles. The drawback of such tiles is that they have to be glued onto the ground with a conductive glue so as to form an anti-static floor, and cannot therefore be displaced to another space.

Another known technique for manufacturing an object with conductive properties from plastic consists of adding solvent-based additives to the plastic composition of the tile. These additives are in fact unsuitable for adding to such a plastic composition because they have the property of migrating, whereby their effect, and thereby also the conductive properties, are lost over time. Another known

technique adds carbon to the plastic composition of the floor tile. This has the drawback however that the objects give off a black colour.

The invention aims to obviate the above stated drawbacks and has the object of providing a tile of the type stated in the preamble and a method for manufacture thereof, with which an anti-static floor can be placed without glueing and can be removed again for use in another space.

The invention proposes for this purpose a tile which is distinguished in that the tile is formed on its peripheral edge with protruding connecting elements for mutual form- fitting connection of the tiles, wherein the network extends at least as far as the peripheral edge of the tile.

This substantially homogeneous network of metal fibres forms an electrically conductive network providing a good conductivity of the tile which is retained because these metal fibres cannot migrate from the tile. These microscopic metal fibres extend up to the edges of the tile such that they make contact with the metal fibres of an adjacent tile when two tiles are connected form-fittingly to each other by means of the protruding connecting elements fitting into each other. In this manner a modular floor is formed in which there extends a continuous fibre network, and the surface resistance of a number of mutually connected tiles will remain sufficiently low without adhesion with a conductive glue being necessary.

Since such tiles are expensive products, it is desirable that they can be reused in an easy manner when for instance a change of location occurs. This is entirely possible with the tiles according to the invention, while it is not possible with glued tiles.

The tile according to the invention further has good mechanical properties and an increased resistance to wear.

According to a preferred embodiment, the protruding connecting elements are dovetail connecting elements.

According to the preferred embodiment, the tile according to the invention has a surface resistance of less than 109 Q. The surface resistance measured on a single tile will for instance be 105 Q, while the surface resistance measured between two random tiles of a floor constructed from such tiles will for instance be 109 Q, which is sufficiently low to be able to speak of an anti-static floor.

In addition, the tile according to the invention preferably has a contact resistance of between 104 and 10 Q.

The values for the surface and contact resistance are used to classify a floor as being anti-static (surface resistance <= 109 Q) and/or conductive (contact resistance <= 105 Q). The required values for the surface and contact resistance will of course depend on the desired application, and more or fewer metal fibres can be arranged in the tile subject to the desired value.

According to a preferred embodiment of the tile according to the invention, the metal fibres have a diameter smaller than 100 pm. The metal fibres typically have a diameter in the order of magnitude of 10 pm and a length in the order of magnitude of millimetres. The skilled person will however appreciate that these values are purely indicative and can be modified without departing from the scope of protection of the invention.

According to a possible variant of the invention, the plastic composition contains PVC. This is a material which is often used for, among other things, tiles for work areas and the like.

The metal fibres which can be used are for instance stainless steel fibres.

The invention further relates to an anti-static floor

constructed from tiles according to any of the above described embodiment variants.

The invention further relates to a method for manufacturing a tile according to the invention, wherein a suitable thermoplastic plastic composition is selected for the tile, metal fibres are added to the thermoplastic plastic composition, the metal fibres are distributed substantially homogeneously through the plastic composition and this composition containing metal fibres is then subjected to a heat treatment in order to form the tile.

Owing to the fact that the metal fibres are distributed substantially homogeneously through the plastic composition and that metal fibres in plastic do not tend to migrate, an object is obtained which retains its conductive properties.

Furthermore, the fine metal fibres do not have an adverse effect on the properties of the object. On the contrary, an additional mechanical strength is imparted to the object by adding metal fibres.

According to a first embodiment of the method according to the invention, the metal fibres are added to the constituents of the plastic composition, whereafter this whole is extruded to form a half-product, this half-product is melted by supplying heat to obtain a melted mass, and this melted mass is finally subjected to the heat treatment so as to form the tile.

The normal plastic mixture for the tile consists for instance of the following constituents: PVC powder, mineral filler, softening agents, stabilizers, lubricants, dyes and so on. Metal fibres are added to this mixture. This mixture is then extruded to form a half-product, for instance in the form of granules. The metal fibres in the extruder are in this way distributed in a homogeneous manner in the plastic mixture.

According to a further developed embodiment variant of the method of the invention, use is made of a known method for bundling the metal fibres in a plastic sheath, wherein the composition of the plastic sheath is modified so as to be compatible with the plastic composition of the tile.

According to this known method, metal fibres consisting for instance of microscopically small inox wires are encased with a sheath so that these fibre bundles form rods which are easy to handle. These rods are for instance marketed by the company Bekaert under the name"Bekishield". The material from which this sheath is manufactured must be compatible with the thermoplastic plastic composition that is used and, when PVC is used, must for instance also have a lower melting point than PVC.

According to a preferred embodiment of the method according to the invention, the heat treatment for forming the tile is performed by injection moulding of the melted mass in a mould.

During the injection moulding process the half-product is for instance melted and injected into a mould in which it takes on the desired form during a further cooling cycle. In this way the metal fibres in the end product are distributed homogeneously over the volume of the tile. The injection moulding process has the further advantage that the microscopically small metal fibres can penetrate into the joins of the mould, whereby these fibres protrude a little from the edge of the tiles and provide a good continuation of the fibre network in a floor constructed from a number of tiles according to the invention.

It may be desirable in particular spaces to have a floor covering system with good conductive properties, a so-called "anti-static"floor, for discharging the static electricity.

Such floors are for instance desirable in electronic and

medicals labs, in spaces where there is explosion hazard, and so on. With the method of the invention tiles can thus be made from plastic with which such an anti-static floor can be laid.

An example of a tile according to the invention will now be further elucidated with reference to the figure description hereinbelow and the single annexed figure, which shows a perspective view of a floor tile according to the invention.

Floor tile 1 is provided on its edges with dovetail connections 2 whereby tiles 1 can be connected to each other without glueing to form an anti-static floor. Tiles 1 are manufactured from a thermoplastic plastic composition which can be the same as that for known classic floor tiles, to which microscopic metal fibres are added.

This exemplary embodiment does not of course limit the scope of protection of the invention which, on the contrary, is defined by the appended claims.