Title:
CONDUCTOR-BONDED STRUCTURE AND METHOD FOR ULTRASONICALLY BONDING CONDUCTORS
Document Type and Number:
WIPO Patent Application WO/2024/048719
Kind Code:
A1
Abstract:
Provided is a bonded structure in which conductors of a plurality of electric wires are ultrasonically bonded together. The conductors include both a conductor 5a that is relatively less likely to be deformed, and a conductor 5b that is relatively more likely to be deformed. That is, two or more types of electric wires comprising conductors of mutually different materials are present. In an axial view of the electric wires, when the direction of ultrasonic bonding is the vertical direction of a conductor bonded portion, and a direction orthogonal thereto is the width direction of the conductor bonded portion, the conductors 5a, 5b made of mutually different materials are disposed substantially symmetrically with respect to the center line A in the width direction.
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Inventors:
NAKAMURA TOSHIHIRO (JP)
NAKAYAMA TOMOHIRO (JP)
YAMADA TAKURO (JP)
NAKAGAWA RYO (JP)
NAKAYAMA TOMOHIRO (JP)
YAMADA TAKURO (JP)
NAKAGAWA RYO (JP)
Application Number:
PCT/JP2023/031813
Publication Date:
March 07, 2024
Filing Date:
August 31, 2023
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
FURUKAWA AUTOMOTIVE SYSTEMS INC (JP)
FURUKAWA AUTOMOTIVE SYSTEMS INC (JP)
International Classes:
H01R4/62; H01R4/02; H01R43/02
Domestic Patent References:
| WO2020080092A1 | 2020-04-23 | |||
| WO2010150351A1 | 2010-12-29 |
Foreign References:
| JP2019008900A | 2019-01-17 | |||
| JP2016054037A | 2016-04-14 | |||
| JP2017076497A | 2017-04-20 | |||
| JP2010113946A | 2010-05-20 | |||
| US20160199932A1 | 2016-07-14 |
Attorney, Agent or Firm:
INOUE, Seiichi (JP)
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