Title:
RF-ID MODULE
Document Type and Number:
WIPO Patent Application WO/2024/048718
Kind Code:
A1
Abstract:
This RF-ID module comprises: a board; first and second lands that are electrodes placed on the side of a first main surface of the board; an RF-ID chip one terminal of which is connected to the second land and the other terminal of which is connected to the first land; a coil conductor that is placed on the side of the first main surface of the board; and a first electrode that is inside the board. The first electrode is opposed to the second land, thereby forming a capacitive pattern, and is connected to the first land via a first interlayer connection conductor. The second land is electrically connected to an end of the coil conductor, while the first electrode is electrically connected to the other end of the coil conductor.
Inventors:
MATSUMOTO KENGO (JP)
Application Number:
PCT/JP2023/031806
Publication Date:
March 07, 2024
Filing Date:
August 31, 2023
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
G06K19/07; G06K19/077; H01F5/00; H01F17/00; H01L25/00; H01Q7/00; H05K3/46
Domestic Patent References:
| WO2017179612A1 | 2017-10-19 | |||
| WO2007138857A1 | 2007-12-06 |
Foreign References:
| JPH09116247A | 1997-05-02 | |||
| US20210066265A1 | 2021-03-04 | |||
| JP2002230501A | 2002-08-16 | |||
| US20210312255A1 | 2021-10-07 |
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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