Title:
CONNECTION TERMINAL
Document Type and Number:
WIPO Patent Application WO/2021/145294
Kind Code:
A1
Abstract:
Provided is a connection terminal comprising a base material of a copper alloy that contains, in mass percentages, 21% ≤ Zn ≤ 27%, 0.6% ≤ Sn ≤ 0.9%, 2.5% ≤ Ni ≤ 3.7%, and 0.01% ≤ P ≤ 0.03%, and containing Cu and unavoidable impurities as the remainder thereof, and that has a 0.2% proof stress of 620-700 MPa and a conductivity of 15-20% IASC.
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Inventors:
SAKAI TOSHIRO (JP)
FURUKAWA KINGO (JP)
MASUDA TAKESHI (JP)
KUWABARA TETSUYA (JP)
TAKASAKI MICHIO (JP)
FURUKAWA KINGO (JP)
MASUDA TAKESHI (JP)
KUWABARA TETSUYA (JP)
TAKASAKI MICHIO (JP)
Application Number:
PCT/JP2021/000601
Publication Date:
July 22, 2021
Filing Date:
January 12, 2021
Export Citation:
Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
MITSUBISHI MATERIALS CORP (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C22C9/04; C22F1/08; H01R13/03; C22F1/00
Domestic Patent References:
WO2015046470A1 | 2015-04-02 |
Foreign References:
JP2001303159A | 2001-10-31 | |||
JP2006283060A | 2006-10-19 | |||
JP2002038246A | 2002-02-06 |
Attorney, Agent or Firm:
WENO & PARTNERS (JP)
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