Title:
CONVEYING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/213566
Kind Code:
A1
Abstract:
This conveying device 1 comprises: a chuck 2 that contactlessly holds a semiconductor chip 103 to face a holding surface 2B; and a guide 3 that has a guide probe 9 capable of abutting a chip side surface 103s of the semiconductor chip 103, and that, for the semiconductor chip 103 held by the chuck 2, limits the movement of the semiconductor chip 103 in the lateral direction in which the guide probe 9 intersects a normal N to the holding surface 2B. The guide probe 9 is capable of reciprocating movement in which a probe tip 9a moves towards and away from the holding surface 2B.
Inventors:
LI JIN (JP)
KIKUCHI HIROSHI (JP)
ENOKIDO SATOSHI (JP)
KIKUCHI HIROSHI (JP)
ENOKIDO SATOSHI (JP)
Application Number:
PCT/JP2020/016291
Publication Date:
October 22, 2020
Filing Date:
April 13, 2020
Export Citation:
Assignee:
SHINKAWA KK (JP)
International Classes:
H01L21/301
Foreign References:
| JP2012099755A | 2012-05-24 | |||
| JP3122750U | 2006-06-29 | |||
| JPH06321351A | 1994-11-22 | |||
| JP4766824B2 | 2011-09-07 | |||
| KR20110125062A | 2011-11-18 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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