COOLING DEVICE AND ELECTRONIC DEVICE USING SAME

WIPO Patent Application WO/2013/073696

A1

[Problem] Sufficient cooling performance cannot be obtained when mounted to a thin electronic device. [Solution] This cooling device is characterized by comprising: an evaporation unit that stores a coolant that vaporizes using heat emitted from a heat-generating body; a condensation unit that condenses the vaporized coolant; a first connection pipe that transfers the coolant that has vaporized in the evaporation unit, to the condensation unit; and a case that houses a second connection pipe that transfers the coolant that has been condensed in the condensation unit to the evaporation unit, and also houses the evaporation unit and the condensation unit. The cooling device is also characterized by: the condensation unit comprising a first connection section that connects to the first connection pipe, a second connection section that connects to the second connection pipe, and a radiation flowpath that connects the first connection section and the second connection section, and through which the coolant flows; the condensation unit being fixed to the upper surface section of the case; and the upper surface section comprising an air vent at a position facing the radiation flowpath.

SHOUJIGUCHI AKIRA (JP)
YOSHIKAWA MINORU (JP)
SAKAMOTO HITOSHI (JP)
CHIBA MASAKI (JP)
INABA KENICHI (JP)
MATSUNAGA ARIHIRO (JP)

PCT/JP2012/079875

May 23, 2013

November 12, 2012

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NEC CORP (JP)
SHOUJIGUCHI AKIRA (JP)
YOSHIKAWA MINORU (JP)
SAKAMOTO HITOSHI (JP)
CHIBA MASAKI (JP)
INABA KENICHI (JP)
MATSUNAGA ARIHIRO (JP)

H01L23/427; H05K7/20

JP2007010211A	2007-01-18
JPS6281874U	1987-05-25
JP2011196632A	2011-10-06
JP2011047616A	2011-03-10

SHIMOSAKA, NAOKI (JP)
Naoki Shimosaka (JP)

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