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Patent Searching and Data


Title:
COOLING DEVICE, HEAT RECEPTION UNIT AND BOILING UNIT USED THEREIN, AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2014/045714
Kind Code:
A1
Abstract:
In order to maintain strong cooling performance even when a heat-generating body generates a small amount of heat, a boiling unit of a heat reception unit in a phase change cooling device comprises a comb-like structural body and a porous layer provided at the base part between the fins of the comb-like structural body. By means of this boiling unit a liquid-phase refrigerant can be converted to a gas-phase refrigerant even when a liquid film of the liquid-phase refrigerant is forcefully made thin and the temperature difference between the gas-phase refrigerant and a heat-receiving surface is small.

Inventors:
MATSUNAGA ARIHIRO (JP)
YOSHIKAWA MINORU (JP)
SAKAMOTO HITOSHI (JP)
SHOUJIGUCHI AKIRA (JP)
CHIBA MASAKI (JP)
INABA KENICHI (JP)
Application Number:
PCT/JP2013/070262
Publication Date:
March 27, 2014
Filing Date:
July 19, 2013
Export Citation:
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Assignee:
NEC CORP (JP)
International Classes:
H01L23/427; H05K7/20
Foreign References:
JPH11330329A1999-11-30
JP2004056151A2004-02-19
JP3086493U2002-06-21
JP2002286384A2002-10-03
JP2010002125A2010-01-07
JP2002314013A2002-10-25
JPH1047668A1998-02-20
JPH11330329A1999-11-30
Other References:
See also references of EP 2899753A4
Attorney, Agent or Firm:
IKEDA, Noriyasu et al. (JP)
Noriyasu Ikeda (JP)
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