Title:
COOLING DEVICE, HEAT RECEPTION UNIT AND BOILING UNIT USED THEREIN, AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2014/045714
Kind Code:
A1
Abstract:
In order to maintain strong cooling performance even when a heat-generating body generates a small amount of heat, a boiling unit of a heat reception unit in a phase change cooling device comprises a comb-like structural body and a porous layer provided at the base part between the fins of the comb-like structural body. By means of this boiling unit a liquid-phase refrigerant can be converted to a gas-phase refrigerant even when a liquid film of the liquid-phase refrigerant is forcefully made thin and the temperature difference between the gas-phase refrigerant and a heat-receiving surface is small.
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Inventors:
MATSUNAGA ARIHIRO (JP)
YOSHIKAWA MINORU (JP)
SAKAMOTO HITOSHI (JP)
SHOUJIGUCHI AKIRA (JP)
CHIBA MASAKI (JP)
INABA KENICHI (JP)
YOSHIKAWA MINORU (JP)
SAKAMOTO HITOSHI (JP)
SHOUJIGUCHI AKIRA (JP)
CHIBA MASAKI (JP)
INABA KENICHI (JP)
Application Number:
PCT/JP2013/070262
Publication Date:
March 27, 2014
Filing Date:
July 19, 2013
Export Citation:
Assignee:
NEC CORP (JP)
International Classes:
H01L23/427; H05K7/20
Foreign References:
JPH11330329A | 1999-11-30 | |||
JP2004056151A | 2004-02-19 | |||
JP3086493U | 2002-06-21 | |||
JP2002286384A | 2002-10-03 | |||
JP2010002125A | 2010-01-07 | |||
JP2002314013A | 2002-10-25 | |||
JPH1047668A | 1998-02-20 | |||
JPH11330329A | 1999-11-30 |
Other References:
See also references of EP 2899753A4
Attorney, Agent or Firm:
IKEDA, Noriyasu et al. (JP)
Noriyasu Ikeda (JP)
Noriyasu Ikeda (JP)
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