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Patent Searching and Data


Title:
COOLING DEVICE AND METHOD FOR ASSEMBLING COOLING DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/124543
Kind Code:
A1
Abstract:
In the present invention, cooling building-material units 21, 22, 23 of a cooling device 1 respectively include: a panel section 21P, 22P, 23P on the front surface of which a plurality of vaporization cooling sections CP formed having a convex cross-section are provided vertically in parallel; and a bracket 210, 220, 230 that is attached to the back surface of the respective panel section 21P, 22P, 23P. The lower ends of the panel sections 21P, 22P of the cooling building-material units 21, 22 in an upper position and upper ends T of the panel sections 22P, 23P of the cooling building-material units 22, 23 in a lower position are in contact with one other. The lower ends of the brackets 210, 220 of the cooling building-material units 21, 22 in an upper position and the upper ends of the brackets 220, 230 of the cooling building-material units 22, 23 in a lower position are in contact with one other. Due to this configuration, assembly of the cooling device is facilitated, and the effort required to install the cooling device is reduced.

Inventors:
HIRAYAMA YUKARI (JP)
OMIGAWA YOSHIMITSU (JP)
INOUE TOMOHIRO (JP)
OHTA ISAMU (JP)
Application Number:
PCT/JP2019/050035
Publication Date:
June 24, 2021
Filing Date:
December 20, 2019
Export Citation:
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Assignee:
MISAWA HOMES CO (JP)
International Classes:
E04B1/76; E04H17/14
Foreign References:
JP2018109266A2018-07-12
JP2018044344A2018-03-22
JP2016176306A2016-10-06
JP2012162886A2012-08-30
JP2014001500A2014-01-09
JP2012140810A2012-07-26
US20100230652A12010-09-16
Attorney, Agent or Firm:
ARAFUNE, Hiroshi (JP)
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