Title:
COOLING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/181481
Kind Code:
A1
Abstract:
A cooling device of the present disclosure cools a plurality of semiconductor components mounted on a front surface of a substrate and arranged in a first direction, the cooling device comprising: a base attached to a rear surface of the substrate; a bottom plate that is disposed apart from the base to thereby form a flow path through which a refrigerant circulates between the bottom plate and the base; and a cooling element disposed inside the flow path, wherein the flow path is provided independently for each semiconductor component and has a plurality of flow path segments extending in a second direction orthogonal to the first direction, and an introduction port for supplying the refrigerant to each flow path segment is formed in the center of the bottom plate in the second direction.
Inventors:
KAWAMIZU TSUTOMU (JP)
MATSUDA HIROKI (JP)
MATSUDA HIROKI (JP)
Application Number:
PCT/JP2022/040415
Publication Date:
September 28, 2023
Filing Date:
October 28, 2022
Export Citation:
Assignee:
MITSUBISHI HEAVY IND LTD (JP)
International Classes:
H01L23/473; H05K7/20
Domestic Patent References:
| WO2018073965A1 | 2018-04-26 |
Foreign References:
| US20210247151A1 | 2021-08-12 | |||
| JP2012044140A | 2012-03-01 | |||
| JP2011166113A | 2011-08-25 | |||
| US20170055378A1 | 2017-02-23 |
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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