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Title:
COOLING METHOD BY REFRIGERANT FOR THREE-DIMENSIONAL LAYERED INTEGRATED CIRCUIT THAT INCLUDES CENTRAL PROCESSING UNIT, GPGPU, AND MEMORY; THREE-DIMENSIONAL LAYERED INTEGRATED CIRCUIT IN WHICH SAID COOLING METHOD IS USED; AND POWER FEEDING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/146724
Kind Code:
A1
Abstract:
This three-dimensional layered integrated circuit comprises interposers that are between the respective integrated circuits of the three-dimensional layered integrated circuit and also below the integrated circuit of the lowermost surface, a movement path for refrigerant is provided in each of the plurality of interposers, and the plurality of movement paths for the refrigerant provided in the plurality of interposers are connected to each other. Alternatively, a three-dimensional layered integrated circuit in which the configuration of a system is simplified by exchanging the refrigerant with the outside in each layer via grooves provided up to the ends of the interposers and configured by liquid immersion. In such a case, a circuit for circulating the refrigerant in the layer direction is not necessary.

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WO/2010/019517LIQUID SUBMERGED, HORIZONTAL COMPUTER SERVER RACK AND SYSTEMS AND METHODS OF COOLING SUCH A SERVER RACK
JP2008227054ELECTRONIC DEVICE
Inventors:
TSUTSUI TAKASHI (JP)
IMANAKA SHIGENORI (JP)
FURUTANI TOMOHIKO (JP)
Application Number:
PCT/JP2019/002351
Publication Date:
August 01, 2019
Filing Date:
January 24, 2019
Export Citation:
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Assignee:
SOFTBANK CORP (JP)
International Classes:
H01L23/473; H01L23/427; H01L25/065; H01L25/07; H01L25/18
Domestic Patent References:
WO2011030467A12011-03-17
WO2012132019A12012-10-04
Foreign References:
JPH08227953A1996-09-03
JP2014187228A2014-10-02
JP2015232500A2015-12-24
US20170186728A12017-06-29
US20100187683A12010-07-29
JP2008159619A2008-07-10
JP2013153083A2013-08-08
JP2009099683A2009-05-07
JP2016219733A2016-12-22
JP2015226061A2015-12-14
Attorney, Agent or Firm:
RYUKA IP LAW FIRM (JP)
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