COPOLYMER AND RESIN COMPOSITION

Title:

COPOLYMER AND RESIN COMPOSITION

Document Type and Number:

WIPO Patent Application WO/2023/022010

Kind Code:

A1

Abstract:

The purpose of the present disclosure is to provide a copolymer having excellent solvent solubility and low dielectric loss tangent. This copolymer includes: an aromatic vinyl monomer unit; a crosslinkable group-containing monomer unit; and a monomer unit from which a homopolymer having a glass transition temperature of 150°C or higher is obtained.

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Inventors:

ISHIKAWA TAKUJI (JP)
FUKUHARA YOSHINARI (JP)
HOGAKI RYOYA (JP)
KAWABE TAKUMA (JP)
IMOTO KATSUHIKO (JP)

Application Number:

PCT/JP2022/029967

Publication Date:

February 23, 2023

Filing Date:

August 04, 2022

Export Citation:

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Assignee:

DAIKIN IND LTD (JP)

International Classes:

C08F212/02; B32B15/082; B32B27/30; C08F212/00; C08F212/08; C08F222/40; C08F236/20; C08L23/20; C08L25/04; C08L29/10; C08L35/06

Domestic Patent References:

WO2021025117A1

2021-02-11

Foreign References:

JP2014517087A	2014-07-17
JP2001089533A	2001-04-03
JP2009244323A	2009-10-22
JP2009258619A	2009-11-05
JP2010031091A	2010-02-12
JP2006023716A	2006-01-26
JP2012113154A	2012-06-14
JP2012112988A	2012-06-14
JP2005139363A	2005-06-02