Title:
COPPER ALLOY FOIL
Document Type and Number:
WIPO Patent Application WO/2015/041348
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a copper alloy foil suitable for applications such as a negative electrode collector for a secondary cell, an FCCL, and an electromagnetic wave shield, and pertains to a copper alloy foil containing a total of 0.01-0.50% by mass of at least one of Ag, Cr, Fe, In, Ni, P, Si, Sn, Te, Ti, Zn, and Zr, the balance comprising Cu and impurities. The copper foil has IACS electroconductivity of 80% or more, and retains a tensile strength of 300 MPa or more after being heated for 30 minutes at 300°C.
Inventors:
HATANO TAKAAKI (JP)
Application Number:
PCT/JP2014/074948
Publication Date:
March 26, 2015
Filing Date:
September 19, 2014
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
C22C9/00; C22C9/02; C22C9/04; C22C9/06; C22C9/10; H01M4/66; H05K1/09; H05K9/00; C22F1/00; C22F1/08
Foreign References:
| JP2004256879A | 2004-09-16 | |||
| JP2013170277A | 2013-09-02 | |||
| JP2012195192A | 2012-10-11 | |||
| JP2000328159A | 2000-11-28 | |||
| JP2007107037A | 2007-04-26 |
Attorney, Agent or Firm:
AXIS Patent International (JP)
Axis international patent business corporation (JP)
Axis international patent business corporation (JP)
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