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Title:
COPPER ALLOY HOT-FORGED PART AND PROCESS FOR PRODUCING COPPER ALLOY HOT-FORGED PART
Document Type and Number:
WIPO Patent Application WO/2012/060359
Kind Code:
A1
Abstract:
This copper alloy hot-forged part has an alloy composition which contains 0.21 to 0.44 mass% of Co, 0.06 to 0.13 mass% of P, 0.003 to 0.08 mass% of Sn and 0.00003 to 0.0030 mass% of O, with the balance consisting of Cu and unavoidable impurities, and in which the Co content, [Co] mass%, and the P content, [P] mass%, satisfy the relationship: 3.1 ≤ ([Co] - 0.005)/([P] - 0.006) ≤ 4.9. In the cross-sectional metal structure, the sum of the fraction of recrystallized-grain groups where the recrystallized grains have an average grain diameter of 0.050 to 0.50mm and the fraction of un-recrystallized grains is 80% or above.

Inventors:
OISHI KEIICHIRO (JP)
TSUGAWA YASUHIRO (JP)
Application Number:
PCT/JP2011/075149
Publication Date:
May 10, 2012
Filing Date:
November 01, 2011
Export Citation:
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Assignee:
MITSUBISHI SHINDO KK (JP)
OISHI KEIICHIRO (JP)
TSUGAWA YASUHIRO (JP)
International Classes:
C22C9/06; C22C9/00; C22C9/04; C22F1/08; H01B1/02; C22F1/00
Domestic Patent References:
WO2009107586A12009-09-03
WO2004079026A12004-09-16
Foreign References:
JP2010212164A2010-09-24
Attorney, Agent or Firm:
OHNAKA Minoru et al. (JP)
Minoru Onaka (JP)
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Claims: