Title:
COPPER ALLOY MATERIAL
Document Type and Number:
WIPO Patent Application WO/2017/081972
Kind Code:
A1
Abstract:
This copper alloy material comprises a composition including greater than or equal to 0.3 mass% to less than 0.5 mass% Cr, from 0.01 mass% to 0.15 mass% inclusive Zr, and Cu and inevitable impurities as the remainder, wherein: the average crystal grain size is within a range from 0.1 mm to 2.0 mm inclusive; and the standard deviation of the crystal grain size is 0.6 or less.
Inventors:
YANO SHOICHIRO (JP)
DAIRAKU KANTA (JP)
SAKAMOTO TOSHIO (JP)
DAIRAKU KANTA (JP)
SAKAMOTO TOSHIO (JP)
Application Number:
PCT/JP2016/080125
Publication Date:
May 18, 2017
Filing Date:
October 11, 2016
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C22C9/00; C22F1/00; C22F1/08
Foreign References:
| JPS58212839A | 1983-12-10 | |||
| JPH0987815A | 1997-03-31 | |||
| JPS58107462A | 1983-06-27 | |||
| CN102534291A | 2012-07-04 |
Other References:
ZHI, XIAOHUI ET AL.: "Effect of zirconium and heat treatment on the microstructure and properties of cast chromium bronze for conductive parts", INTERNATIONAL JOURNAL OF MATERIALS RESEARCH, vol. 106, no. 2, February 2015 (2015-02-01), pages 192 - 194, XP009510788, ISSN: 0044-3093, DOI: 10.3139/146.111164
KENZO YAMAMOTO ET AL.: "High strength copper mold materials for electro-magnetic stirring and electro-magnetic brake in the mold", CURRENT ADVANCES IN MATERIALS AND PROCESSES, vol. 16, no. 1, 1 March 2003 (2003-03-01), pages 222, XP 009511107
KENZO YAMAMOTO ET AL.: "High strength copper mold materials for electro-magnetic stirring and electro-magnetic brake in the mold", CURRENT ADVANCES IN MATERIALS AND PROCESSES, vol. 16, no. 1, 1 March 2003 (2003-03-01), pages 222, XP 009511107
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
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