Title:
COPPER ALLOY, COPPER ALLOY PLASTIC WORKING MATERIAL, ELECTRONIC/ELECTRICAL DEVICE COMPONENT, TERMINAL, BUSBAR, HEAT-DISSIPATING BOARD
Document Type and Number:
WIPO Patent Application WO/2021/107102
Kind Code:
A1
Abstract:
This copper alloy has a composition containing an Mg content in the range of 70-400 mass ppm, inclusive, and an Ag content in the range of 5-20 mass ppm, inclusive, with the remainder thereof constituting Cu and inevitable impurities, wherein the P content is less than 3.0 mass ppm, the conductivity is at least 90% IACS, and the length LLB of the low-angle grain boundary and sub-grain boundary and the length LHB of the high-angle grain boundary satisfy the relationship LLB/(LLB+LHB)>20%.
Inventors:
MATSUNAGA HIROTAKA (JP)
ITO YUKI (JP)
MORI HIROYUKI (JP)
MATSUKAWA HIROYUKI (JP)
ITO YUKI (JP)
MORI HIROYUKI (JP)
MATSUKAWA HIROYUKI (JP)
Application Number:
PCT/JP2020/044244
Publication Date:
June 03, 2021
Filing Date:
November 27, 2020
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C22C9/00; C22F1/00; C22F1/02; C22F1/08; H01B1/02
Domestic Patent References:
| WO2019189558A1 | 2019-10-03 | |||
| WO2019189534A1 | 2019-10-03 |
Foreign References:
| JP2017179490A | 2017-10-05 | |||
| JP2019178399A | 2019-10-17 | |||
| JP2019178398A | 2019-10-17 | |||
| JP2019216553A | 2019-12-19 | |||
| JP2016056414A | 2016-04-21 |
Other References:
See also references of EP 4067518A1
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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