COPPER ALLOY PLATE MATERIAL, METHOD FOR PRODUCING COPPER ALLOY PLATE MATERIAL, AND CONTACT COMPONENT

WIPO Patent Application WO/2022/092139

A1

The present invention provides: a copper alloy plate material which is suppressed in a decrease in the strength associated with an increase in temperature, while having high strength at high temperatures and excellent electrical conductivity; and the like.　A copper alloy plate material which has an alloy composition that contains from 0.5% by mass to 5.0% by mass of Ni and/or Co in total, and from 0.10% by mass to 1.50% by mass of Si, with the mass ratio of the total content of Ni and Co to the Si content, namely (Ni + Co)/Si being from 2.00 to 6.00, and with the balance being made up of copper and unavoidable impurities. This copper alloy plate material comprises an Si compound that contains Si and at least one of Ni and Co in the matrix, while having a diffusion layer that contains Cu, Si and at least one of Ni and Co in the boundary region between the Si compound and the matrix as observed with a three-dimensional atom probe field ion microscope; and the average thickness of the diffusion layer is from 0.5 nm to 5.0 nm.

JP3046932	CORROSION RESISTANT COPPER ALLOY EXCELLENT IN HIGH TEMPERATURE DUCTILITY AND ANNEALING BRITTLENESS RESISTANCE
JP7470575	Parts for electrical/electronic equipment
WO/2010/113553	CU-CO-SI COPPER ALLOY FOR USE IN ELECTRONICS, AND MANUFACTURING METHOD THEREFOR

AKIYA SHUNTA (JP)
SASAKI HIROKAZU (JP)
KAWATA SHINGO (JP)
TAKAZAWA TSUKASA (JP)

PCT/JP2021/039615

May 05, 2022

October 27, 2021

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FURUKAWA ELECTRIC CO LTD (JP)

C22C9/06; C22F1/08; H01B5/02; C22F1/00

JP2012072470A	2012-04-12
JP2011252188A	2011-12-15
JP6152212B1	2017-06-21
JP2016186107A	2016-10-27

SAITO Takuya et al. (JP)

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