Title:
CURABLE COMPOSITION, ARTICLE, CONFIRMATION METHOD, AND ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2022/092140
Kind Code:
A1
Abstract:
A curable composition including a polymerizable compound (A) and a polymerization initiator (B). A cured product of this curable composition has a temperature-loss tangent (tanδ) graph half width of from 90°C to 150°C, obtained by measuring the dynamic viscoelasticity under measurement conditions comprising frequency: 1.0 Hz, mode: tension mode, measurement temperature range: from -50°C to 200°C, heating rate: 2°C/min.
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Inventors:
TAKAHASHI YUSUKE (JP)
TAKANO CHIAKI (JP)
TAKANO CHIAKI (JP)
Application Number:
PCT/JP2021/039616
Publication Date:
May 05, 2022
Filing Date:
October 27, 2021
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
C08F290/04; C09J4/02; G01N21/64
Foreign References:
| JP2012144641A | 2012-08-02 | |||
| JP2006160861A | 2006-06-22 | |||
| JPS5616561A | 1981-02-17 | |||
| JP2007077321A | 2007-03-29 | |||
| JPH07232424A | 1995-09-05 | |||
| JPH05331438A | 1993-12-14 | |||
| JP6297405B2 | 2018-03-20 | |||
| JP2010530060W | ||||
| JP2009530464W | ||||
| JP2020181256A | 2020-11-05 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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