Title:
COPPER ALLOY POWDER HAVING EXCELLENT LASER ABSORPTIVITY
Document Type and Number:
WIPO Patent Application WO/2019/168166
Kind Code:
A1
Abstract:
This copper alloy powder having excellent laser absorptivity contains one or both of B and S in the amount of 0.003% by mass to 5.0% by mass, the remainder comprising unavoidable impurities and Cu, the average particle diameter of the copper alloy powder being 20 µm to 80 µm. This copper alloy powder having excellent laser absorptivity is preferably a powder for metal additive manufacturing.
Inventors:
KATO JUN (JP)
ITO YUKI (JP)
MATSUKAWA HIROYUKI (JP)
ITO YUKI (JP)
MATSUKAWA HIROYUKI (JP)
Application Number:
PCT/JP2019/008150
Publication Date:
September 06, 2019
Filing Date:
March 01, 2019
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
B22F1/05; B22F3/105; B22F3/16; B33Y70/00; C22C9/00
Foreign References:
| JP2008095169A | 2008-04-24 | |||
| JP2014005491A | 2014-01-16 | |||
| JP2016211062A | 2016-12-15 | |||
| JP2018036502A | 2018-03-08 | |||
| JP2017141505A | 2017-08-17 | |||
| JP2016211062A | 2016-12-15 |
Other References:
See also references of EP 3760342A4
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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