COPPER ALLOY SHEET, METHOD FOR MANUFACTURING SAME, ELECTRICAL/ELECTRONIC DEVICE HEAT RADIATION COMPONENT, AND SEALED CASE

WIPO Patent Application WO/2019/176838

A1

This copper alloy sheet has an alloy composition that contains 0-4.5% by mass of Ni, 0-2.0% by mass of Co, 0.2-1.3% by mass of Si, 0-0.5% by mass of Mg, 0-0.5% by mass of Cr, 0-0.25% by mass of Sn, 0-0.6% by mass of Zn, 0-0.15% by mass of Zr, and 0-0.25% by mass of Mn, the total Ni and Co content being 0.8-5.0% by mass, the ratio {(Ni + Co)/Si} of the total Ni and Co content relative to the Si content being 2.0-6.0, and the balance being Cu and unavoidable impurities, the copper alloy sheet having a rolled texture, wherein: the rolled texture is such that the average value of orientation density of β-fiber (φ2 = 45-90°), obtained on the basis of rolled texture analysis using EBSD, is within the range of 3.0-25.0, the tensile strength in a direction parallel to rolling is 600 MPa or more, and the spring-up height of a sample piece processed in a strip shape having a length of 100 mm under the conditions stipulated in JBMA T304 (1999) is 2.0 mm or less; and the copper alloy sheet has exceptional heat radiation properties, adequate strength, low residual strain, and exceptional bendability.

AKIYA SHUNTA (JP)
ISOMATSU TAKEMI (JP)
HIGUCHI MASARU (JP)
DANJO SHOICHI (JP)

PCT/JP2019/009614

September 19, 2019

March 11, 2019

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FURUKAWA ELECTRIC CO LTD (JP)

C22C9/06; C22F1/08; C22F1/00

JP2017160513A	2017-09-14
JP2015101760A	2015-06-04
US5846346A	1998-12-08

SAITO Takuya et al. (JP)

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