Title:
COPPER ALLOY
Document Type and Number:
WIPO Patent Application WO/2013/125623
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a copper alloy plate which has excellent strength, electrical conductivity and bendability. A copper alloy of the present invention contains 0.10-0.50% of Cr, 0.010-0.30% of Ti and 0.01-0.10% of Si so that the mass ratio of the Cr to the Ti satisfies 1.0 ≤ (Cr/Ti) ≤ 30 and the mass ratio of the Cr to the Si satisfies 3.0 ≤ (Cr/Si) ≤ 30, with the balance being made up of copper and unavoidable impurities. This copper alloy is characterized in that when the metal structure of a surface that is perpendicular to the width direction of the copper alloy is measured by an FESEM-EBSP method, the crystal grains have an average major axis length of 6.0 μm or less and an average minor axis length of 1.0 μm or less.
Inventors:
SHISHIDO HISAO
TANAKA YUKI
SUMINO YUYA
FUGONO AKIRA
TANAKA YUKI
SUMINO YUYA
FUGONO AKIRA
Application Number:
PCT/JP2013/054293
Publication Date:
August 29, 2013
Filing Date:
February 21, 2013
Export Citation:
Assignee:
KOBE STEEL LTD (JP)
International Classes:
C22C9/00; C22C9/01; C22C9/02; C22C9/04; C22C9/06; C22C9/10; H01B1/02; C22F1/00; C22F1/08
Foreign References:
| JPS6260837A | 1987-03-17 | |||
| JP2515127B2 | 1996-07-10 | |||
| EP0784099A2 | 1997-07-16 | |||
| JP2012214882A | 2012-11-08 |
Attorney, Agent or Firm:
UEKI, Kyuichi et al. (JP)
Hisakazu Ueki (JP)
Hisakazu Ueki (JP)
Download PDF:
Claims: