PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR CURED FILM, CURED FILM, ORGANIC EL DISPLAY DEVICE, AND LIQUID CRYSTAL DISPLAY DEVICE

Title:

PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR CURED FILM, CURED FILM, ORGANIC EL DISPLAY DEVICE, AND LIQUID CRYSTAL DISPLAY DEVICE

Document Type and Number:

WIPO Patent Application WO/2013/125624

Kind Code:

A1

Abstract:

Provided is a photosensitive resin composition having high sensitivity, and having an excellent exposure margin at a low dielectric constant.　A photosensitive resin composition containing: a polymer component (A) fulfilling at least either (1) or (2) ((1)): A constituent unit (a1) having a residue wherein an acid group is protected by an acid degradable group, and a polymer (a2) having a constituent unit having a crosslinking group. (2): A polymer (a1) having a constituent unit having a residue wherein an acid group is protected by an acid degradable group, and a polymer (a2) having a constituent unit having a crosslinking group.); at least two types of photoacid generator (B); and a solvent (D). At least one of the at least two types of photoacid generator (B) is a compound (B-F) that causes an acid having fluorine in the molecules thereof to be generated using light; at least one of the other types is a compound other than (B-F); and the compound (B-F) is selected from a triarylsulfonium salt, a diaryliodonium salt, an oxime sulfonate compound, an imide sulfonate compound, and a diazomethane compound.

More Like This:

JP2006133756	LITHOGRAPHIC PRINTING PLATE PRECURSOR REQUIRING NO DAMPENING WATER
JP2023097347	METHOD FOR MANUFACTURING VAPOR DEPOSITION MASK
JP2002365793	POSITIVELY WORKING PLANOGRAPHIC PRINTING PLATE PRECURSOR

Inventors:

ANDO TAKESHI (JP)
HIKITA MASANORI (JP)

Application Number:

PCT/JP2013/054294

Publication Date:

August 29, 2013

Filing Date:

February 21, 2013

Export Citation:

Click for automatic bibliography generation Help

Assignee:

FUJIFILM CORP (JP)

International Classes:

G03F7/004; C08F212/02; C08F220/26; G03F7/039; H01L21/027; H01L51/50; H05B33/22

Foreign References:

JP2011232648A	2011-11-17
JP2000241965A	2000-09-08
JP2007304528A	2007-11-22
JP2009258723A	2009-11-05
JP2013011866A	2013-01-17

Attorney, Agent or Firm:

SIKs & Co. (JP)
Patent business corporation patent firm Sykes (JP)

Download PDF:

View/Download PDF PDF Help

Claims:

Previous Patent: COPPER ALLOY

Next Patent: HEAT TRANSFER PIPE FOR FIN AND TUBE-TYPE HEAT EXCHANGER AND FIN AND TUBE-TYPE HEAT EXCHANGER USING S...