Title:
COPPER-CLAD LAMINATE, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING COPPER-CLAD LAMINATE
Document Type and Number:
WIPO Patent Application WO/2020/017551
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing: a copper-clad laminate which is suppressed in the occurrence of a blister; a method for producing this copper-clad laminate; and a printed wiring board and a semiconductor package, each of which uses this copper-clad laminate. The present invention relates to: a copper-clad laminate which comprises an insulating layer that contains a resin and a copper foil that is arranged on at least one surface of the insulating layer, and which is configured such that the copper foil is a surface-treated copper foil that has a metal treatment layer containing zinc, and the amount of zinc in the metal treatment layer is 10-2,500 μ/dm2; a method for producing this copper-clad laminate; and a printed wiring board and a semiconductor package, each of which uses this copper-clad laminate.
Inventors:
SHIRAOKAWA YOSHIKATSU (JP)
KAMOSHIDA SHINICHI (JP)
KUROKAWA HIROSHI (JP)
KAMOSHIDA SHINICHI (JP)
KUROKAWA HIROSHI (JP)
Application Number:
PCT/JP2019/028081
Publication Date:
January 23, 2020
Filing Date:
July 17, 2019
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
B32B15/08; B32B15/20; H05K1/09
Foreign References:
| JP2017007327A | 2017-01-12 | |||
| JP2018090903A | 2018-06-14 | |||
| JP2013062441A | 2013-04-04 | |||
| JP2013075948A | 2013-04-25 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
Download PDF: