Title:
COPPER ETCHANT FOR REMOVING COPPER SEED LAYER
Document Type and Number:
WIPO Patent Application WO/2024/034426
Kind Code:
A1
Abstract:
The present invention provides a copper etchant which is for removing a copper seed and has sufficient copper seed layer removability and with which an increase in the surface roughness of a copper wiring or a copper electrode and circuit thinning are suppressed. The present invention provides a copper etchant for removing a copper seed layer, the copper etchant being characterized by containing an organic acid and hydrogen peroxide and having a pH of 5.0-8.0.
Inventors:
SHIMIZU YU (JP)
HOMMA HIDEKAZU (JP)
KITA KOJI (JP)
HOMMA HIDEKAZU (JP)
KITA KOJI (JP)
Application Number:
PCT/JP2023/027679
Publication Date:
February 15, 2024
Filing Date:
July 28, 2023
Export Citation:
Assignee:
OKUNO CHEM IND CO (JP)
International Classes:
C23F1/18; H05K3/06
Foreign References:
| JP2010265524A | 2010-11-25 | |||
| JP2022052909A | 2022-04-05 | |||
| JP2017031502A | 2017-02-09 | |||
| JP2013076119A | 2013-04-25 |
Attorney, Agent or Firm:
SAEGUSA & PARTNERS (JP)
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