Title:
ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2024/034425
Kind Code:
A1
Abstract:
This electronic component comprises: an element body (20); and a first external electrode (61) that covers an outer surface (21) of the element body (20). The first external electrode (61) has a first base electrode (61A), and a first metal layer (61B) that covers the outer surface (610) of the first base electrode (61A). The first base electrode (61A) contains copper and silicon. At least a portion of the copper is in the form of copper particles (63) having a flatness ratio of at most 0.5. When the first base electrode (61A) is viewed in cross-section, a silicone resin (64), which contains silicon, is distributed to be filled between a plurality of copper particles (63).
Inventors:
OOKAWA NORIYUKI (JP)
Application Number:
PCT/JP2023/027678
Publication Date:
February 15, 2024
Filing Date:
July 28, 2023
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01G9/048; H01C7/00; H01C7/02; H01C7/04; H01C7/06; H01C7/10; H01F27/29; H01G4/008; H01G4/30; H01G9/042
Domestic Patent References:
| WO2016186053A1 | 2016-11-24 |
Foreign References:
| JP2021019123A | 2021-02-15 | |||
| JP2022057923A | 2022-04-11 |
Attorney, Agent or Firm:
FUKUI Hiroshi (JP)
Download PDF:
Previous Patent: COMPOSITION FOR ENHANCING MOTIVATION
Next Patent: COPPER ETCHANT FOR REMOVING COPPER SEED LAYER
Next Patent: COPPER ETCHANT FOR REMOVING COPPER SEED LAYER