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Title:
COPPER FILM FORMING METHOD AND COPPER FILM FORMING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2015/079914
Kind Code:
A1
Abstract:
A method by which a copper film is formed on a substrate in a supercritical fluid, wherein a dimer of (N,N'-diisopropyl propionic amidinate) copper is dissolved in the supercritical fluid, copper is deposited on the substrate, and a copper film is formed.

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Inventors:
MACHIDA HIDEAKI (JP)
ISHIKAWA MASATO (JP)
SUDOH HIROSHI (JP)
KONDOH EIICHI (JP)
Application Number:
PCT/JP2014/079959
Publication Date:
June 04, 2015
Filing Date:
November 12, 2014
Export Citation:
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Assignee:
GAS PHASE GROWTH LTD (JP)
International Classes:
C23C26/00; C23C16/18; C23C18/38
Foreign References:
JP2011111676A2011-06-09
JP2008502680A2008-01-31
Attorney, Agent or Firm:
MAEJIMA Daigo et al. (JP)
Daigo Maejima (JP)
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