Title:
COPPER FOIL WITH ATTACHED CARRIER FOIL AND COPPER-CLAD LAMINATE
Document Type and Number:
WIPO Patent Application WO/2015/080052
Kind Code:
A1
Abstract:
In order to provide a copper foil having an attached carrier foil, whereby the carrier foil can be easily peeled off a copper foil layer even when used during copper-clad laminate production using temperatures of at least 250°C, a copper foil having an attached carrier foil is provided that comprises a layer structure including a carrier foil, a bonded interface layer, and a copper foil layer. The copper foil having the attached carrier foil is characterized by using as the carrier foil an electrolytic copper foil that, after heat treatment for 60 minutes at 250°C, has a tensile strength of at least 40 kgf/mm2.
Inventors:
MATSUNAGA TETSUHIRO (JP)
MATSUDA MITSUYOSHI (JP)
TAKANASHI AKITOSHI (JP)
KAWAI NOBUYUKI (JP)
MATSUDA MITSUYOSHI (JP)
TAKANASHI AKITOSHI (JP)
KAWAI NOBUYUKI (JP)
Application Number:
PCT/JP2014/080921
Publication Date:
June 04, 2015
Filing Date:
November 21, 2014
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO (JP)
International Classes:
C25D1/04; B32B15/20; C25D7/06; H05K1/09
Foreign References:
| JP2001062955A | 2001-03-13 | |||
| JP2010222657A | 2010-10-07 | |||
| JP2007294923A | 2007-11-08 | |||
| JP2007217791A | 2007-08-30 |
Attorney, Agent or Firm:
YOSHIMURA, KATSUHIRO (JP)
Katsuhiro Yoshimura (JP)
Katsuhiro Yoshimura (JP)
Download PDF: