Title:
COPPER PARTICLE SOLDER PASTE, AND PREPARATION METHOD AND SINTERING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2022/061834
Kind Code:
A1
Abstract:
A copper particle solder paste, and a preparation method and a sintering method therefor. The copper particle solder paste comprises copper particles having good dispersion, a dispersant, and a solvent, and further comprises a reductant, wherein the amount of the reductant is 0.5-5 parts by weight. The reductant includes at least one of ascorbic acid, copper formate, formic acid, acetic acid, and acetone oxime. By adding the reductant to the copper particle solder paste, not only the oxide layer on the surface of the copper particles can be removed, but also the copper particle solder paste can be prevented from being oxidized again during storage and use; in addition, since the added reductant and an oxidation product thereof are prone to be thermally decomposed, and do not hinder the sintering process, the copper particle solder paste can be sintered at a low temperature without reducing gas protection during sintering, thereby not only reducing production costs, but also widening the application range of the copper particle solder paste.
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Inventors:
LIU ZHIQUAN (CN)
GAO YUE (CN)
SUN RONG (CN)
GAO YUE (CN)
SUN RONG (CN)
Application Number:
PCT/CN2020/118173
Publication Date:
March 31, 2022
Filing Date:
September 27, 2020
Export Citation:
Assignee:
SHENZHEN INST ADV TECH (CN)
International Classes:
B23K35/02; B23K35/40; B23K35/36
Foreign References:
| CN110238562A | 2019-09-17 | |||
| CN109332939A | 2019-02-15 | |||
| CN110814575A | 2020-02-21 | |||
| CN106825998A | 2017-06-13 | |||
| CN111618475A | 2020-09-04 | |||
| CN111618314A | 2020-09-04 | |||
| CN109317859A | 2019-02-12 | |||
| CN112351598A | 2021-02-09 | |||
| JPH05212579A | 1993-08-24 |
Attorney, Agent or Firm:
CHINA WISPRO INTELLECTUAL PROPERTY LLP. (CN)
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