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Title:
COPPER PLATING ADDITIVE COMPOSITIONS, COPPER PLATING SOLUTIONS, AND USES THEREOF
Document Type and Number:
WIPO Patent Application WO/2023/179704
Kind Code:
A1
Abstract:
Provided are a copper plating additive composition, a copper plating solution, and a copper brush plating method using the same. The copper plating additive composition includes 1, 4-cyclohexanedione monoethylene acetal, potassium phthalimide, and an amino polyol compound.

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Inventors:
LIU GUOCHUN (CN)
LI XUEFA (CN)
ZHANG GUOPING (CN)
Application Number:
PCT/CN2023/083344
Publication Date:
September 28, 2023
Filing Date:
March 23, 2023
Export Citation:
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Assignee:
JIANGYIN NANOPORE INNOVATIVE MATERIALS TECH LTD (CN)
International Classes:
C25D3/38; C23C14/20; C23C14/24; C25D5/06; C25D5/22; C25D5/56
Foreign References:
CN114540889A2022-05-27
CN114561674A2022-05-31
US4310392A1982-01-12
CN105887144A2016-08-24
JPS6256592A1987-03-12
CN113502474A2021-10-15
Attorney, Agent or Firm:
ADVANCE CHINA IP LAW OFFICE (CN)
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