Title:
COPPER STRAND FOR BONDING WIRE AND METHOD FOR PRODUCING COPPER STRAND FOR BONDING WIRE
Document Type and Number:
WIPO Patent Application WO/2013/015154
Kind Code:
A1
Abstract:
This copper strand for a bonding wire is a copper strand for forming a bonding wire having a wire diameter of 180 µm or less. The strand diameter of the copper strand is between 0.15 and 3.0 mm. The copper strand is formed from one or more additional elements selected from Mg, Ca, Sr, Ba, Ra, Zr, Ti, and rare earth elements such that the total content is within a range between 0.0001 and 0.01 mass%, and copper and inevitable impurities as the balance. The copper strand has a specific grain boundary ratio (Lσ/L), which is the ratio of the length of a specific grain boundary Lσ to the total length L of the crystal grain boundary, that is 50% or greater as determined by EBSD.
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Inventors:
KUMAGAI SATOSHI (JP)
NAKAMOTO HITOSHI (JP)
NAKAMOTO HITOSHI (JP)
Application Number:
PCT/JP2012/068090
Publication Date:
January 31, 2013
Filing Date:
July 17, 2012
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
KUMAGAI SATOSHI (JP)
NAKAMOTO HITOSHI (JP)
KUMAGAI SATOSHI (JP)
NAKAMOTO HITOSHI (JP)
International Classes:
H01L21/60; B21C1/00; C22C9/00; C22F1/08
Domestic Patent References:
| WO2011086978A1 | 2011-07-21 |
Foreign References:
| JPS63286212A | 1988-11-22 | |||
| JP2010214400A | 2010-09-30 |
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
Masatake Shiga (JP)
Masatake Shiga (JP)
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Claims: